Fabrication of the tile type transceiver module package for X-band phase array radar using selectively anodized aluminum substrate

Abstract

In this paper, we proposed a tile type transceiver module package for X-band phase array radar system using a selectively anodized aluminum substrate. The proposed solution of package is based on thick anodized aluminum oxide (Al2O3) layers and bare chips mounted on aluminum for an effective heat sink. This package method can be further contributed to decreasing cost, reducing module size and managing thermal problem for the microwave high power T/R modules.