High frequency performance and packaging of power film capacitors

Abstract

This paper discusses lead terminations for dry metallized polypropylene film capacitors designed specifically for the purpose of lowering the series inductance and increasing the pulse handling performance capability required for power electronic applications. This paper also discusses issues associated with testing polymer film capacitors for power electronic applications; specifically high frequency testing, accelerated aging due to high voltage rate-of-rise wave shapes and thermal shock due to electronic assembly processing such as soldering, cleaning and encapsulating or potting.