Analysis of high speed design on a multilayer PCB substrate

Abstract

This paper gives an overview of desirable factors that influence the circuit board designed on a printed circuit board and the characteristic of high-speed design board. Signal integrity, as the name suggests includes degradation and timing errors of digital waveforms, for example, they travel along the conductors that make up the path, such as Circuit board traces, packaging structure and connectors. These conductors represent the transmission lines. Signal integrity of the signals propagating across the board is one of the prime factors to be considered in digital circuit design as these parameters are used in electromagnetic analysis of cross talk, signal degradation, propagation delays etc. on a PCB transmission lines. Modern high-speed circuit board designs require special attention because of their short operating frequency and short rise time. So, this literature presents the most important aspects and parameters that PCB designers should consider and analyze before creating a circuit board layout. This literature also discusses on the basic high-speed PCB design guidelines and challenges occurring at the development stage of a board.