Effects of UV laser milling parameters on the profile cutting of Gorilla glass substrates

C. Chung, S. Tseng, W. Hsiao, J. Yeh
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引用次数: 1

Abstract

The purposes of this study were to develop a high-speed milling system combined with an ablation path of the parallel lines and to investigate the cut quality on the glass substrates conducted by a nanosecond pulsed Nd:YVO4 laser (λ:355 nm). Experimental specimens were commercial Corning Gorilla glass with a thickness of 800 μm. Laser milling parameters including the laser fluence, number of milling pass, and scan speed of galvanometers along the processing path were adjusted for the profile cutting of the glass substrates. The laser milled depth, surface morphology, and surface roughness of the glass substrates after laser milling were measured by a 3D confocal laser scanning microscope. Experimental results showed that the milled depth outstandingly increased as increasing the laser fluence and the number of milling pass or decreasing the scan speed of galvanometers. The milled depths averagely increased from 38 μm to 107 μm when the scan speed of galvanometers decreased from 1500 mm/s to 300 mm/s with the laser fluence of 52 J/cm2 in a one-cycle milling process. Moreover, the milled depths averagely increased from 107 μm to 185 μm when the laser fluence decreased from 54 J/cm2 to 95 J/cm2 with the scan speed of galvanometers of 300 mm/s. When the number of milling pass increased to 5 with the laser fluences of 95 J/cm2 and scan speed of 300 mm/s, the Gorilla glass substrate was cut through a square hole. The edge of milled hollow square structures on the glass substrate had few of micro cracks, square angles, and steep and oblique walls around the milled boundaries as increasing the number of milling pass. In addition, the value of surface roughness increased with increasing the numbers of milling pass.
紫外激光铣削参数对大猩猩玻璃基板轮廓切割的影响
本研究的目的是开发一种结合平行线烧蚀路径的高速铣削系统,并研究纳秒脉冲Nd:YVO4激光器(λ:355 nm)对玻璃基板的切割质量。实验试样为商用康宁大猩猩玻璃,厚度为800 μm。调整激光铣削参数,包括激光辐照度、铣削孔道数和振镜沿加工路径的扫描速度,以实现玻璃基板的轮廓切割。利用三维共聚焦激光扫描显微镜测量了激光铣削后的玻璃基板的激光铣削深度、表面形貌和表面粗糙度。实验结果表明,随着激光辐照度和铣削孔道数的增加或振镜扫描速度的降低,铣削深度显著增加。当激光辐照强度为52 J/cm2时,振镜扫描速度从1500 mm/s降低到300 mm/s,铣削深度从38 μm增加到107 μm。激光辐照强度从54 J/cm2减小到95 J/cm2,振镜扫描速度为300 mm/s时,铣削深度从107 μm增加到185 μm。当激光强度为95 J/cm2,扫描速度为300 mm/s,铣削道数增加到5道时,大猩猩玻璃基板通过一个方孔切割。随着铣削孔道数的增加,玻璃基板上的空心方形结构铣削边缘微裂纹、方角较少,铣削边界周围壁陡斜。表面粗糙度值随铣削孔道数的增加而增大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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