Anomaly Detection Using Deep CNN-ELM in Semiconductor Manufacturing

Jae-Min Cha, Hye-Ju Ha, Seokhyun Gong, J. Jeong
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引用次数: 0

Abstract

In modern society, technology is constantly evolving. This technological advancement creates new demands from consumers. To meet the needs of consumers, companies must improve the quality of their products. Semiconductor manufacturing requires many processes and fine techniques. Because of these characteristics, small defects or anomaly values have a great influence on the semiconductor yield. However, defects can be prevented if an anomaly can be determined from data collected during the semiconductor manufacturing process. In this paper, we propose an anomaly detection model that combines the deep convolutional neural network and extreme learning machine network. The proposed model provides better performance in detecting anomalies in semiconductor manufacturing data by taking advantage of the two models. The results of the proposed model are compared and analyzed with a widely used anomaly detection model.
基于深度CNN-ELM的半导体制造异常检测
在现代社会,技术是不断发展的。这种技术进步给消费者带来了新的需求。为了满足消费者的需求,公司必须提高产品的质量。半导体制造需要许多工艺和精细的技术。由于这些特性,微小的缺陷或异常值对半导体成品率有很大的影响。然而,如果可以从半导体制造过程中收集的数据中确定异常,则可以防止缺陷。本文提出了一种结合深度卷积神经网络和极限学习机网络的异常检测模型。利用这两种模型,该模型在半导体制造数据异常检测中具有更好的性能。将该模型的结果与一种常用的异常检测模型进行了比较和分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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