Electro-Thermal Interaction on Circuit Level under the Influence of Packaging

Abstract

Selfheating and electro-thermal interaction is a serious problem in the eld of analog controlled power applications. Power generating elements and temperature critical components propagate heat and sense the instantaneous temperature during an electrothermal circuit simulation. The thermal conductivity of silicon is temperature dependent. We present fully coupled electro-thermal simulation by solving the nonlinear heat di usion equation in silicon while taking into account the in uence of packaging.