Polarity dependent of gate oxide breakdown from measurements

Shili Wu, Xiaowei He, Yuwei Liu, Guoan Chen
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引用次数: 1

Abstract

In this work, polarity dependent of gate oxide breakdown is investigated for both NMOS and PMOS in a large range of oxide thicknesses, 27Å, 170Å and 850Å. All the devices are measured using constant voltage stress (CVS) method. From the measurements, It is found that for thick gate oxide, lifetime (TBD) under negative gate bias is always shorter regardless of the types of the MOSFETs. However, when the oxide thickness scaled down, the accumulation case gets shorter lifetime than the inversion case for both NMOS and PMOS. In addition, the gate current changes over the stress time for different oxide thicknesses are also exhibited which imply different breakdown processes.
极性依赖的栅极氧化物击穿从测量
在这项工作中,极性依赖于栅极氧化物击穿的NMOS和PMOS在大范围的氧化物厚度,27Å, 170Å和850Å的研究。所有器件均采用恒压应力(CVS)法进行测量。从测量中发现,对于厚栅极氧化物,无论何种类型的mosfet,在负栅极偏置下的寿命(TBD)总是较短。然而,当氧化物厚度减小时,NMOS和PMOS的累积情况寿命都比反转情况短。此外,在不同的氧化层厚度下,栅电流随应力时间的变化也显示出不同的击穿过程。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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