Advanced MCM-Ls for consumer electronics

Abstract

We have developed an advanced MCM (multichip module) using the SBB/sup TM/ (stud-bump bonding) flip-chip technique on an ALIVH/sup TM/ (any layer inner via hole) structure substrate. The SBB technique is an advanced flip-chip bonding technique for high density MCM, which can mount bare LSI chips directly on substrates. The bonding portion structure is composed of Au bumps with two-stepped construction and conductive adhesives. The conductive adhesive is very flexible in bond, thus relaxing thermal and mechanical stresses. The ALIVH substrate is a high density and high performance multilayered printed wiring board with any layer inner via hole structure, CO/sub 2/ laser via hole processing technology and interconnection technology which employs conductive paste. We had good results for several reliability tests in the advanced MCM-L test vehicles. In particular, in the thermal shock test, the increase in connection resistance in the advanced MCM-Ls was smaller than that of MCM-Ls which used ordinary organic substrates instead of the ALIVH substrate. We manufactured a CCD camera module using these MCM-Ls. LSI chips were mounted on the six-layered ALIVH substrate. The MCM-Ls obtained was downsized (60% down) and lighter in weight (30% reduction) when compared with the conventional module, and the electrical characteristics of the newly manufactured CCD camera module were equal to those of the conventional module.