Comparison of R-1233zd and HFE-7000 Condenser Performance in Pumped Two-Phase Cooling Systems

A. Pegallapati, N. Karwa
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Abstract

The increasing heat flux from chips and high server- and rack-level heat densities in high-performance computing infrastructure have resulted in an increased interest in pumped two-phase cooling. It has been demonstrated that pumped two-phase cooling using dielectric fluorinated fluids in cold plates significantly reduces case temperature and improves case temperature uniformity over single-phase water cooling. Karwa and Yana Motta [1] compared the performance of low-pressure dielectric heat transfer fluids with system pressure less than 60 psi in microchannel cold plates and showed that R-1233zd(E) (normal boiling point: 18.26 °C) provided improved performance over HFE-7000 (normal boiling point: 34.2 °C). The present study extends their work and presents results of experimental and theoretical evaluation of condenser performance in pumped two-phase cooling systems. Tube-fin type air-cooled condensers were simulated using a detailed tube-by-tube model in Genesym™, and the performance of brazed plate water-cooled condensers was determined experimentally. The performance of air-cooled and water-cooled condensers for low-pressure heat transfer fluids R-1233zd(E) and HFE-7000 were compared. It is demonstrated that, for the same performance, R-1233zd(E) requires almost 35% smaller air-cooled condenser as compared to HFE-7000 and the fluid charge in the system can be reduced by 65%. It has been shown that dielectric fluid side heat transfer coefficient is the controlling heat transfer coefficient in brazed plate water-cooled condenser, and up to 20% higher dielectric fluid heat transfer coefficient was achieved for R-1233zd than HFE-7000 in brazed plate condensers. This study shows that R-1233zd(E) is a feasible low-pressure heat transfer fluid option for both air- and water-cooled pumped two-phase cooling systems.
R-1233zd与HFE-7000泵送两相冷却系统冷凝器性能比较
在高性能计算基础设施中,芯片的热通量不断增加,服务器和机架级的热密度也越来越高,这导致人们对泵送两相冷却的兴趣越来越大。已经证明,与单相水冷却相比,在冷板中使用介电氟化流体的泵送两相冷却可显著降低壳体温度并改善壳体温度均匀性。Karwa和Yana Motta[1]比较了系统压力小于60 psi的低压介质传热流体在微通道冷板中的性能,表明R-1233zd(E)(正常沸点:18.26°C)比HFE-7000(正常沸点:34.2°C)的性能更好。本研究扩展了他们的工作,提出了泵送两相冷却系统中冷凝器性能的实验和理论评价结果。采用Genesym™软件对管翅式风冷冷凝器进行了详细的逐管模型模拟,并对钎焊板水冷冷凝器的性能进行了实验研究。比较了R-1233zd(E)和HFE-7000两种低压换热流体的风冷式和水冷式冷凝器的性能。结果表明,在相同的性能下,R-1233zd(E)所需的风冷冷凝器比HFE-7000小近35%,系统中的流体充注量可减少65%。结果表明,介质侧换热系数是钎焊板式冷凝器的控制换热系数,其中R-1233zd型的介质侧换热系数比HFE-7000型高20%。研究表明,R-1233zd(E)是风冷和水冷泵送两相冷却系统中可行的低压换热流体选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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