{"title":"Computation of Cross-Coupling for Reliable System Operation","authors":"H. Kadim, L. M. Coulibaly","doi":"10.1109/EST.2012.10","DOIUrl":null,"url":null,"abstract":"Critical applications in areas such as defence, security and space exploration will have design challenges created by factors such as cost, size and tolerance. Scaled technologies will offer a huge potential in these areas, as they are inherently faster, low-power, low-cost and more harsh-environment tolerant. Moving toward nanoscale designs will trigger many design challenges that need to be addressed and dealt with for better system performance and reliability of operation. One such design challenge is the close proximity of on-chip interconnects coupled with reduced dielectric-thickness, leading to cross-coupling effects. The effect of cross-coupling may range from minor performance deterioration to system failure - thus impeding planned operations and tasks. A method for effectively and efficiently describing and determining the cross-coupling effects between multi-layer, multi-coupled interconnect-systems is presented.","PeriodicalId":314247,"journal":{"name":"2012 Third International Conference on Emerging Security Technologies","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-09-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 Third International Conference on Emerging Security Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EST.2012.10","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Critical applications in areas such as defence, security and space exploration will have design challenges created by factors such as cost, size and tolerance. Scaled technologies will offer a huge potential in these areas, as they are inherently faster, low-power, low-cost and more harsh-environment tolerant. Moving toward nanoscale designs will trigger many design challenges that need to be addressed and dealt with for better system performance and reliability of operation. One such design challenge is the close proximity of on-chip interconnects coupled with reduced dielectric-thickness, leading to cross-coupling effects. The effect of cross-coupling may range from minor performance deterioration to system failure - thus impeding planned operations and tasks. A method for effectively and efficiently describing and determining the cross-coupling effects between multi-layer, multi-coupled interconnect-systems is presented.