Understanding lead frame surface treatment and its impact on package reliability

Renyi Wang, R. Kuder, B. Wu, G. Emmerson, G. Seeley
{"title":"Understanding lead frame surface treatment and its impact on package reliability","authors":"Renyi Wang, R. Kuder, B. Wu, G. Emmerson, G. Seeley","doi":"10.1109/ECTC.2002.1008215","DOIUrl":null,"url":null,"abstract":"Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Lead frame micro-electronic packages are still the most widely used in the semiconductor industry. The surface properties of metal lead frames are involved in several important interfacial interactions within micro-electronic packages and hence have crucial impact on package integrity and reliability. In this work, detailed investigations were carried out to elucidate the chemical compositions of surface treatment solutions as well as the chemical and physical properties of lead frame surfaces. Results from /sup 1/H nuclear magnetic resonance (NMR), X-ray photoelectron spectroscopy (XPS), optical microscopy, and static secondary ion mass spectroscopy (SSIMS) are described. Adhesion testing data obtained from lead frames with different surface treatments, and with die attach adhesives of various chemistries, are reported. In addition, JEDEC reliability tests, using a new die attach adhesive, were performed on molded packages with different packaging material combinations and the results are reported.
了解引线框表面处理及其对封装可靠性的影响
引线框架微电子封装仍然是半导体工业中应用最广泛的封装形式。金属引线框架的表面特性涉及微电子封装中几个重要的界面相互作用,因此对封装的完整性和可靠性具有至关重要的影响。在这项工作中,进行了详细的研究,以阐明表面处理溶液的化学成分以及引线框架表面的化学和物理性质。描述了/sup 1/H核磁共振(NMR)、x射线光电子能谱(XPS)、光学显微镜和静态二次离子质谱(SSIMS)的结果。附着力测试数据,从引线框架与不同的表面处理,并与模具附加粘合剂的各种化学,报告。此外,采用一种新型模附胶对不同包装材料组合的模制封装进行了JEDEC可靠性测试,并报告了测试结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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