New polyimides containing aliphatic segments and thin films based on them

D. Popovici, C. Hulubei, V. Musteata, M. Brumǎ, A. Muller
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Abstract

A series of polyimides (PI) based on two dianhydrides, namely 5-(2,5-dioxotetra-hydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylicanhydride (DOCDA) and benzophenonetetracarboxylicdianhydride (BTDA), and an aliphatic diamine, namely 1,6 diaminohexane (DAH), have been obtained by solution polycondensation reaction, followed by thermal ring closure of the resulting polyamic acids. The chemical structures were identified by infrared and 1H-NMR spectroscopy and their thermal and electrical properties (dielectric constant and dielectric loss at different frequencies) were investigated. The polymers showed good thermal stability, with no significant weight loss up to 340°C, with 5% weight loss temperature in the range of 345–430°C and glass transition temperatures (Tgs) between 122–190°C. The resulting polyimides gave flexible films by thermal imdization of poly (amic acid) precursors. The AFM analysis revealed a smooth topography of their surfaces, with root-mean-square (Sq) roughness between 0.42–6.32 nm and average roughness (Sa) in the range of 0.33–2.39 nm. The dielectric constants of the PI films varied between 3.05 and 2.68 at 1 MHz frequency. The correlation between the polymers structure and their properties has been discussed.
含脂肪段的新型聚酰亚胺及其薄膜
以5-(2,5-二氧四氢-3-呋喃基)-3-甲基-3-环己烯-1,2-二甲酸二酐(DOCDA)和苯二苯四甲酸四甲酸二酐(BTDA)两种二酐和1,6 -二甲酸二胺(DAH)为原料,通过溶液缩聚反应制得一系列聚酰亚胺(PI),并进行热封环反应。利用红外光谱和核磁共振光谱对其化学结构进行了鉴定,并对其热学和电学性能(介电常数和不同频率下的介电损耗)进行了研究。聚合物表现出良好的热稳定性,在340℃以下无明显失重,在345 ~ 430℃范围内失重5%,玻璃化转变温度(Tgs)在122 ~ 190℃之间。所得聚酰亚胺通过聚酰胺酸前驱体的热成像得到柔性薄膜。AFM分析显示其表面形貌光滑,均方根粗糙度(Sq)在0.42 ~ 6.32 nm之间,平均粗糙度(Sa)在0.33 ~ 2.39 nm之间。在1 MHz频率下,PI薄膜的介电常数在3.05 ~ 2.68之间变化。讨论了聚合物的结构与性能之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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