{"title":"Simplified Over- Temperature Protection Circuit Structure for WSN/IoT Device Power Management","authors":"J. Hora, Xi Zhu, E. Dutkiewicz","doi":"10.1109/ICST46873.2019.9047726","DOIUrl":null,"url":null,"abstract":"This paper presents a modified structure of the over-temperature protective circuit integrated into the power management converter design for wireless sensor node devices. The design is focused on realizing a simplified circuit structure that is compatible with standard CMOS technology structure and evaluating the over-temperature threshold to assure needed accuracy. HSPICE simulation using Monte Carlo Analysis for the bandgap voltage reference is used to get a better estimation, process variation, and reliability. The target design temperature threshold is obtained at approximately 150 °C, which is the standard chip testing value at worst temperature consideration. Post-layout simulation of the proposed circuit design structure is carried out using 65nm 1P9M CMOS 1.2V/2.5V logic CMOS technology. And it is co-integrated in the power management circuit design for the system-on-chip wireless sensor node device.","PeriodicalId":344937,"journal":{"name":"2019 13th International Conference on Sensing Technology (ICST)","volume":"08 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 13th International Conference on Sensing Technology (ICST)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICST46873.2019.9047726","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
This paper presents a modified structure of the over-temperature protective circuit integrated into the power management converter design for wireless sensor node devices. The design is focused on realizing a simplified circuit structure that is compatible with standard CMOS technology structure and evaluating the over-temperature threshold to assure needed accuracy. HSPICE simulation using Monte Carlo Analysis for the bandgap voltage reference is used to get a better estimation, process variation, and reliability. The target design temperature threshold is obtained at approximately 150 °C, which is the standard chip testing value at worst temperature consideration. Post-layout simulation of the proposed circuit design structure is carried out using 65nm 1P9M CMOS 1.2V/2.5V logic CMOS technology. And it is co-integrated in the power management circuit design for the system-on-chip wireless sensor node device.