Exploring Fault-Tolerant Network-on-Chip Architectures

Dongkook Park, C. Nicopoulos, Jongman Kim, N. Vijaykrishnan, C. Das
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引用次数: 246

Abstract

The advent of deep sub-micron technology has exacerbated reliability issues in on-chip interconnects. In particular, single event upsets, such as soft errors, and hard faults are rapidly becoming a force to be reckoned with. This spiraling trend highlights the importance of detailed analysis of these reliability hazards and the incorporation of comprehensive protection measures into all network-on-chip (NoC) designs. In this paper, we examine the impact of transient failures on the reliability of on-chip interconnects and develop comprehensive counter-measures to either prevent or recover from them. In this regard, we propose several novel schemes to remedy various kinds of soft error symptoms, while keeping area and power overhead at a minimum. Our proposed solutions are architected to fully exploit the available infrastructures in an NoC and enable versatile reuse of valuable resources. The effectiveness of the proposed techniques has been validated using a cycle-accurate simulator
探索容错的片上网络架构
深亚微米技术的出现加剧了片上互连的可靠性问题。特别是,单个事件的干扰,如软错误和硬错误,正迅速成为一股不容忽视的力量。这种螺旋式上升的趋势凸显了详细分析这些可靠性危害以及在所有片上网络(NoC)设计中纳入综合保护措施的重要性。在本文中,我们研究了瞬态故障对片上互连可靠性的影响,并制定了全面的对策来防止或恢复它们。在这方面,我们提出了几种新的方案来补救各种软错误症状,同时保持最小的面积和功耗开销。我们提出的解决方案旨在充分利用NoC中可用的基础设施,并实现有价值资源的多种重用。所提出的技术的有效性已通过周期精确模拟器进行验证
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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