Power electronics packaging and miniature using chip-scale packaged power devices

Abstract

The authors present a power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional integrated power electronics modules (IPEMs). The chip-scale packaging structure, termed Die Dimensional Ball Grid Array (D/sup 2/BGA), eliminates wire bonds by using stacked solder bumps to interconnect power chips. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniaturisation possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultra-low profile packaging. In this paper, the authors introduce the D/sup 2/BGA power chip-scale package, and present the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported.