An overview of integratable current sensor technologies

Abstract

An overview is given of current sensing technologies that are suitable for packaging into integrated power electronics modules and integrated passive power processing units, such as integrated shunts and integratable Rogowski coils technologies. Technologies considered in this paper include: integrated current shunts, current transformers, Rogowski coils, Hall-effect current sensors, giant magneto resistive sensors (GMR) and magneto impedance sensors (MI). Each of these current sensing technologies is discussed separately along with their advantages, limitations and design trade-offs. Special emphasis is given to features that enhance or limit the technology's potential for being integrated in the packaging process.