Fabrication challenge, device characterization of high-Q 2D, 3D passives devices on glass

Sheng-Chi Hsieh, Chien-Hua Chen, Yung-shun Chang, T. Lee, Pao-Nan Lee, Chen-Chao Wang, Yuan-Hsi Chou
{"title":"Fabrication challenge, device characterization of high-Q 2D, 3D passives devices on glass","authors":"Sheng-Chi Hsieh, Chien-Hua Chen, Yung-shun Chang, T. Lee, Pao-Nan Lee, Chen-Chao Wang, Yuan-Hsi Chou","doi":"10.1109/EDAPS.2016.7893130","DOIUrl":null,"url":null,"abstract":"It is demonstrated that the high quality factor of thick metal spiral inductors, 3D solenoid inductor and low harmonics power level can be achieved by using a mature glass substrate technology. The quality factor of inductors in a 2D/3D type can achieve 70∼100 in this study. The harmonics power level is measured along transmission line and 2nd /3rd harmonics can be below −110 dBm at 30 dBm input power. It is very critical and helpful with high Q-factor and lower harmonics power level for the FEM development of current and next generation's commercial 4G carrier aggregation system.","PeriodicalId":191549,"journal":{"name":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","volume":"20 ","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2016.7893130","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

It is demonstrated that the high quality factor of thick metal spiral inductors, 3D solenoid inductor and low harmonics power level can be achieved by using a mature glass substrate technology. The quality factor of inductors in a 2D/3D type can achieve 70∼100 in this study. The harmonics power level is measured along transmission line and 2nd /3rd harmonics can be below −110 dBm at 30 dBm input power. It is very critical and helpful with high Q-factor and lower harmonics power level for the FEM development of current and next generation's commercial 4G carrier aggregation system.
玻璃上高q 2D, 3D无源器件的制造挑战,器件特性
结果表明,采用成熟的玻璃基板技术,可以实现厚金属螺旋电感、三维电磁电感的高品质因数和低谐波功率水平。在本研究中,2D/3D类型电感器的质量因子可以达到70 ~ 100。沿传输线测量谐波功率电平,在输入功率为30dbm时,2 /3次谐波可低于- 110dbm。高q因子和低谐波功率水平对当前和下一代商用4G载波聚合系统的有限元开发至关重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信