Dynamic Thermal Management through Task Scheduling

Jun Yang, Xiuyi Zhou, M. Chrobak, Youtao Zhang, Lingling Jin
{"title":"Dynamic Thermal Management through Task Scheduling","authors":"Jun Yang, Xiuyi Zhou, M. Chrobak, Youtao Zhang, Lingling Jin","doi":"10.1109/ISPASS.2008.4510751","DOIUrl":null,"url":null,"abstract":"The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor's reliability and reduces its lifetime. While hardware level dynamic thermal management (DTM) techniques, such as voltage and frequency scaling, can effectively lower the chip temperature when it surpasses the thermal threshold, they inevitably come at the cost of performance degradation. We propose an OS level technique that performs thermal- aware job scheduling to reduce the number of thermal trespasses. Our scheduler reduces the amount of hardware DTMs and achieves higher performance while keeping the temperature low. Our methods leverage the natural discrepancies in thermal behavior among different workloads, and schedule them to keep the chip temperature below a given budget. We develop a heuristic algorithm based on the observation that there is a difference in the resulting temperature when a hot and a cool job are executed in a different order. To evaluate our scheduling algorithms, we developed a lightweight runtime temperature monitor to enable informed scheduling decisions. We have implemented our scheduling algorithm and the entire temperature monitoring framework in the Linux kernel. Our proposed scheduler can remove 10.5-73.6% of the hardware DTMs in various combinations of workloads in a medium thermal environment. As a result, the CPU throughput was improved by up to 7.6% (4.1% on average) even under a severe thermal environment.","PeriodicalId":137239,"journal":{"name":"ISPASS 2008 - IEEE International Symposium on Performance Analysis of Systems and software","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-04-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"138","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ISPASS 2008 - IEEE International Symposium on Performance Analysis of Systems and software","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPASS.2008.4510751","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 138

Abstract

The evolution of microprocessors has been hindered by their increasing power consumption and the heat generation speed on-die. High temperature impairs the processor's reliability and reduces its lifetime. While hardware level dynamic thermal management (DTM) techniques, such as voltage and frequency scaling, can effectively lower the chip temperature when it surpasses the thermal threshold, they inevitably come at the cost of performance degradation. We propose an OS level technique that performs thermal- aware job scheduling to reduce the number of thermal trespasses. Our scheduler reduces the amount of hardware DTMs and achieves higher performance while keeping the temperature low. Our methods leverage the natural discrepancies in thermal behavior among different workloads, and schedule them to keep the chip temperature below a given budget. We develop a heuristic algorithm based on the observation that there is a difference in the resulting temperature when a hot and a cool job are executed in a different order. To evaluate our scheduling algorithms, we developed a lightweight runtime temperature monitor to enable informed scheduling decisions. We have implemented our scheduling algorithm and the entire temperature monitoring framework in the Linux kernel. Our proposed scheduler can remove 10.5-73.6% of the hardware DTMs in various combinations of workloads in a medium thermal environment. As a result, the CPU throughput was improved by up to 7.6% (4.1% on average) even under a severe thermal environment.
基于任务调度的动态热管理
微处理器的发展受到其不断增加的功耗和芯片上的热产生速度的阻碍。高温会损害处理器的可靠性并缩短其使用寿命。虽然硬件级动态热管理(DTM)技术,如电压和频率缩放,可以有效地降低芯片温度,当它超过热阈值时,它们不可避免地以性能下降为代价。我们提出一种操作系统级别的技术,执行热感知作业调度,以减少热越界的数量。我们的调度器减少了硬件dtm的数量,在保持低温度的同时实现了更高的性能。我们的方法利用了不同工作负载之间热行为的自然差异,并对它们进行调度,以保持芯片温度低于给定的预算。我们开发了一种启发式算法,该算法基于这样的观察,即当热工和冷工以不同的顺序执行时,产生的温度是不同的。为了评估我们的调度算法,我们开发了一个轻量级的运行时温度监视器,以支持明智的调度决策。我们已经在Linux内核中实现了调度算法和整个温度监测框架。我们建议的调度器可以在中等温度环境下的各种工作负载组合中删除10.5-73.6%的硬件dtm。因此,即使在恶劣的热环境下,CPU吞吐量也提高了7.6%(平均4.1%)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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