M. Mehrotra, J. Wu, A. Jain, T. Laaksonen, K. Kim, W. Bather, R. Koshy, J. Chen, J. Jacobs, V. Ukraintsev, L. Olsen, J. Deloach, J. Mehigan, R. Agarwal, S. Walsh, D. Sekel, L. Tsung, M. Vaidyanathan, B. Trentman, K. Liu, S. Aur, R. Khamankar, P. Nicollian, Q. Jiang, Y. Xu, B. Campbell, P. Tiner, R. Wise, D. Scott, M. Rodder
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引用次数: 8
Abstract
In this work, we present a 60 nm gate length CMOS for high performance applications at the 0.13 /spl mu/m CMOS node. The technology utilizes 193 nm gate lithography, dual spacers with thin spacer before drain extension implant and L-shaped nitride spacer after drain extensions, and remote-plasma nitrided dielectric with 1.75 nm EOT. 10-15% improvement in drive current is achieved with lower series resistance by reduction of dopant loss and higher dopant activation, resulting in n- and pMOS I/sub drive/ of 1160 /spl mu/A//spl mu/m and 550 /spl mu/A//spl mu/m at 1.3 V at I/sub off/=100 nA//spl mu/m.
在这项工作中,我们提出了一种60 nm栅长CMOS,用于0.13 /spl mu/m CMOS节点的高性能应用。该技术采用193nm栅极光刻技术,在漏极延伸植入前采用薄间隔层,漏极延伸植入后采用l形氮化间隔层的双间隔层,以及1.75 nm EOT的远程等离子体氮化电介质。通过减少掺杂损耗和提高掺杂激活度,在降低串联电阻的情况下实现了10-15%的驱动电流提高,从而使n-和pMOS的I/sub驱动在1.3 V下为1160 /spl μ l /A//spl μ l μ m和550 /spl μ l μ l /A//spl μ m, I/sub off =100 nA//spl μ m。