60 nm gate length dual-Vt CMOS for high performance applications

M. Mehrotra, J. Wu, A. Jain, T. Laaksonen, K. Kim, W. Bather, R. Koshy, J. Chen, J. Jacobs, V. Ukraintsev, L. Olsen, J. Deloach, J. Mehigan, R. Agarwal, S. Walsh, D. Sekel, L. Tsung, M. Vaidyanathan, B. Trentman, K. Liu, S. Aur, R. Khamankar, P. Nicollian, Q. Jiang, Y. Xu, B. Campbell, P. Tiner, R. Wise, D. Scott, M. Rodder
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引用次数: 8

Abstract

In this work, we present a 60 nm gate length CMOS for high performance applications at the 0.13 /spl mu/m CMOS node. The technology utilizes 193 nm gate lithography, dual spacers with thin spacer before drain extension implant and L-shaped nitride spacer after drain extensions, and remote-plasma nitrided dielectric with 1.75 nm EOT. 10-15% improvement in drive current is achieved with lower series resistance by reduction of dopant loss and higher dopant activation, resulting in n- and pMOS I/sub drive/ of 1160 /spl mu/A//spl mu/m and 550 /spl mu/A//spl mu/m at 1.3 V at I/sub off/=100 nA//spl mu/m.
60纳米栅长双vt CMOS高性能应用
在这项工作中,我们提出了一种60 nm栅长CMOS,用于0.13 /spl mu/m CMOS节点的高性能应用。该技术采用193nm栅极光刻技术,在漏极延伸植入前采用薄间隔层,漏极延伸植入后采用l形氮化间隔层的双间隔层,以及1.75 nm EOT的远程等离子体氮化电介质。通过减少掺杂损耗和提高掺杂激活度,在降低串联电阻的情况下实现了10-15%的驱动电流提高,从而使n-和pMOS的I/sub驱动在1.3 V下为1160 /spl μ l /A//spl μ l μ m和550 /spl μ l μ l /A//spl μ m, I/sub off =100 nA//spl μ m。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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