Obtaining high quality VLSI packages with QFD

K. Pearsall, R. Raines, M. Schoellmann
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Abstract

Component end users want a high quality, reliable part. However, the expected failure rate, cost etc. may vary from one customer to the next. The amount of control that a packaging vendor is expected to put in place so that he can meet those requirements can be assessed through the implementation of QFD (quality function deployment). One such work effort that strives to use this technique for the definition and subsequent optimization of these controls for delivering high quality PQFP's (plastic quad flat packs) is described.<>
通过QFD获得高质量的VLSI封装
组件终端用户希望得到高质量、可靠的部件。然而,预期的故障率、成本等可能因客户而异。包装供应商为满足这些需求而期望实施的控制量可以通过QFD(质量功能部署)的实现来评估。一个这样的工作努力,努力使用这种技术的定义和这些控制的后续优化,以提供高质量的PQFP(塑料四平面包装)被描述。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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