Thermal performance of heat sink for cooling high LED power applications

Abstract

The aim of this article is to build an analytic thermal resistance of the heat sink used for high led power. The thermal model is defined in order to predict the mean temperature of the heat source of the LED by establishing a network model based on heat flux flow distribution. The thermal model is developed by finding a relationship between the heat sink resistance and their geometry; wish is implemented in SIMULINK/M. The results of the model are comparing with 3D finite element simulation by COMSOL in order to validate the model proposed.