Modeling of temperature frequency-compensation of doped silicon MEMS resonator

P. Rajai, Matthew Straeten, Jiewen Liu, G. Xereas, M. Ahamed
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引用次数: 5

Abstract

In this paper, an analytical model is presented to predict the temperature sensitivity of doped silicon MEMS resonator. Temperature coefficients of three elastic constants (C11, C12 and C44) were predicted and found in good agreement (∼1%) with the experimental values previously reported in the literature. The model was then extended to find relationship between doping and temperate-compensated frequency. Our model shows that the Lame mode frequency of a MEMS resonator can be compensated via an optimum n-doping of around 4×1019cm−3 for working temperature between −40°C to 100 °C.
掺杂硅MEMS谐振器的温度频率补偿建模
本文提出了一个预测掺硅MEMS谐振腔温度灵敏度的解析模型。对三个弹性常数(C11、C12和C44)的温度系数进行了预测,发现与文献中先前报道的实验值吻合良好(约1%)。然后对模型进行扩展,找出掺杂与温度补偿频率之间的关系。我们的模型表明,MEMS谐振器的Lame模式频率可以通过4×1019cm - 3左右的最佳n掺杂来补偿,工作温度在- 40°C至100°C之间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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