PbSe and PbTe epitaxial films alloyed with tin: potential thin film materials with high ZT around room temperature?

J. Nurnus, H. Bottner, J. Konig, A. Lambrecht
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引用次数: 2

Abstract

For room temperature applications, normally V-VI-compounds with ZT values around 1 are used in the field of bulk thermoelectrics. In the case of thin film materials, several challenges arise from the complex crystal structure of these compounds due to strongly anisotropic thermoelectric transport parameters. This limits, or at least complicates the use of V-VI based thin films. Therefore, materials with a comparably simple crystal structure and isotropic transport properties are desirable. These needs are fulfilled in the case of IV-VI-compounds. Unfortunately, those materials suffer from their relatively low ZT of /spl sim/0.2 around room temperature. Here, we report on structural and in particular thermoelectric properties of molecular beam epitaxy grown PbSe and PbTe thin films alloyed with tin. It was found that increasing the tin concentration without changing the other growth parameters results in increased charge carrier concentrations and thermopower values. Special care was taken to evaluate the in-plane thermal conductivity of insulated free standing Pb/sub 1-x/Sn/sub x/Te and Pb/sub 1-x/Sn/sub x/Se thin films. As expected, also the lattice thermal conductivity decreases due to alloy scattering. Increasing the tin concentration is known to result in decreasing bandgaps. By this, the optimum operating temperature is shifted towards ambient temperature. All those effects strongly enhance the thermoelectric properties of Pb/sub 1-x/Sn/sub x/Te and Pb/sub 1-x/Sn/sub x/Se in the room temperature region. For tin contents of x/spl sim/0.08, ZT>0.6 were determined in both cases. Even higher ZT values should be achievable using e.g. adequate doping levels and/or quaternary Pb/sub 1-x/Sn/sub x/Te/sub 1-y/Se/sub y/ compounds.
镀锡的PbSe和PbTe外延薄膜:室温下高ZT的潜在薄膜材料?
对于室温应用,通常ZT值约为1的v - vi化合物用于体热电领域。在薄膜材料的情况下,由于强各向异性热电输运参数,这些化合物的复杂晶体结构产生了一些挑战。这限制了,或者至少使基于V-VI的薄膜的使用复杂化。因此,需要具有相对简单的晶体结构和各向同性输运特性的材料。这些需求在iv - vi化合物的情况下得到满足。不幸的是,这些材料在室温下的ZT相对较低,为/spl sim/0.2。本文报道了分子束外延生长的PbSe和PbTe锡合金薄膜的结构和热电性能。结果发现,在不改变其他生长参数的情况下,增加锡浓度会导致载流子浓度和热功率值的增加。研究了Pb/sub - 1-x/Sn/sub -x/ Te和Pb/sub - 1-x/Sn/sub -x/ Se薄膜的平面内导热系数。正如预期的那样,由于合金的散射,晶格导热系数也降低了。已知增加锡浓度会导致带隙减小。通过这种方法,使最佳工作温度向环境温度偏移。这些效应都增强了Pb/sub - 1-x/Sn/sub -x/ Te和Pb/sub - 1-x/Sn/sub -x/ Se在室温区域的热电性能。当锡含量为x/spl sim/0.08时,ZT均>0.6。使用适当的掺杂水平和/或季元Pb/sub - 1-x/Sn/sub -x/ Te/sub - 1-y/Se/sub -y/化合物可以实现更高的ZT值。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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