Investigating the NBTI effect on P- and N-substrate MOS capacitors and p-MOSFET transistors

A. Benabdelmoumene, B. Djezzar, H. Tahi, A. Chenouf, Goudjil Mohamed, M. Kechouane
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引用次数: 1

Abstract

Using measure/stress/measure (MSM) protocol, Negative bias temperature instability (NBTI) has been investigated on P-and N-substrate MOS capacitors through flat band shift evolution. The same protocol on p-MOSFET's transistors, with different channel lengths, has been also examined through threshold voltage shift evolution. The results have shown that P-substrate MOS capacitors are more affected than N-substrate MOS capacitors. We have suggested that the amphoteric nature of interface traps and the positive nature of the oxide traps could explain this result. In addition, the exponent n is higher in N-substrate than in P-substrate capacitors. Higher the degradation is, lower n is. On the other hand, we have shown that P-doped lightly doped drain (LDD) and source/drain regions of p-MOSFET transistors are more affected than the middle of the channel under NBTI stress conditions. These results point out the influence of the Boron doping on the NBTI degradation. Also, this behavior suggests that the generation mechanism in the edge region is different from that in the channel region.
研究NBTI对P衬底和n衬底MOS电容器和P- mosfet晶体管的影响
利用测量/应力/测量(MSM)协议,通过平坦带移演化研究了p -和n -衬底MOS电容器的负偏置温度不稳定性(NBTI)。同样的协议在p-MOSFET的晶体管上,具有不同的通道长度,也通过阈值电压漂移演化进行了检查。结果表明,p衬底MOS电容器比n衬底MOS电容器受影响更大。我们认为界面陷阱的两性性质和氧化物陷阱的正电荷性质可以解释这一结果。此外,n衬底电容器的n指数高于p衬底电容器。退化越高,n越低。另一方面,我们已经表明,在NBTI应力条件下,p-MOSFET晶体管的p掺杂轻掺杂漏极(LDD)和源/漏极区比通道中间受到的影响更大。这些结果指出硼掺杂对NBTI降解的影响。同时,这种行为表明边缘区域的生成机制与通道区域的产生机制不同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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