High efficiency operation of 6-H SiC MESFETs at 6 GHz

S. Sriram, R. Barron, A. Morse, T.J. Smith, G. Augustine, A. Burk, R. C. Clarke, R. Glass, H. Hobgood, P. A. Orphanos, R. Siergiej, C. Brandt, M. Driver, R. Hopkins
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引用次数: 13

Abstract

Summary form only given. SiC MESFETs are very promising candidates for RF power amplification, due to their unique combination of high saturation velocity, high breakdown strength, and high thermal conductivity. In the present work, we demonstrate for the first time high efficiency RF power operation at 6 GHz. We have obtained power output of 35 W, with 45.5% power added efficiency at 6 GHz from a 6-H SiC MESFET operating at a drain bias of 40 V. The gate length and width were 0.5 /spl mu/m and 2 mm respectively. The corresponding power density is 1.75 W/mm and is more than a factor of 3 higher than that obtained normally in GaAs. To our knowledge, these results represent the highest power output, efficiency, and operating frequency reported to date in SiC. The power MESFETs were fabricated on high resistivity SiC substrates grown at Westinghouse. Sintered Ni ohmic contacts, mesa isolation, and channel recessing using RIE were used in device fabrication. Air-bridge source interconnects were used for large periphery devices. The fabrication and characterization of these SiC power MESFETs are presented.
6- h SiC mesfet在6 GHz的高效率工作
只提供摘要形式。SiC mesfet由于其高饱和速度、高击穿强度和高导热性的独特组合,是射频功率放大的非常有前途的候选者。在本工作中,我们首次演示了6 GHz频段的高效射频功率工作。我们在40 V漏极偏置下工作的6- h SiC MESFET获得了35 W的功率输出,在6 GHz时功率增加效率为45.5%。栅长0.5 μ m,栅宽2 mm。相应的功率密度为1.75 W/mm,比GaAs中通常获得的功率密度高3倍以上。据我们所知,这些结果代表了迄今为止在SiC中报道的最高功率输出,效率和工作频率。功率mesfet是在西屋公司生长的高电阻率SiC衬底上制备的。烧结镍欧姆触点、台面隔离和通道凹槽使用RIE在器件制造中使用。大型外围设备采用气桥源互连。介绍了这些SiC功率mesfet的制备方法和性能。
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