Interdigital and Multi-Via Structures for Mushroom-Type Metasurface Reflectors

Abstract

In this paper, the novel patch element shapes with the interdigital and multi-via structures of a mushroom-type metasurface reflector are proposed. The interdigital structure provides a wide reflection phase range by changing the depth of the interdigital fingers. In addition, the multi-via structure provides the reflection phases near +180°. These structures have low polarization dependent properties. The desired reflection angles and sharp far field patterns of the reflected beams were obtained in the simulation results.