Optimization of the flow boiling heat transfer structure for power electronics

Abstract

Self-circulating evaporative cooling technology can solve the bottleneck problem of high heat flux heat dissipation of the power electronic devices. The liquid box in the system topology is in direct contact with the heating device. The evaporative cooling medium flows through the box and boils on the internal surface. So, the inner surface structure is very important for the heat dissipation. This paper in view of the heat flux density of 140 kW/ m2 and core temperature below 70^${\circ}$C heat demand, compares the enhanced array structures of pin-fins and ribs with different rib heights and rib spacing by simulation. As comprehensive consideration in thermal efficiency, flow resistance, processing, material consumption, the optimal structure for enhanced heat dissipation is determined. The correctness of the selection results is verified by experiments. The reliable design process for optimal selection of enhanced structure is given.