Stability analysis of different dual-port SRAM cells in deep submicron region using N-Curve Method

Shourya Gupta, K. Gupta, N. Pandey
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引用次数: 3

Abstract

In this paper, different dual-port SRAM cell structures have been analysed in deep submicron regions. Dual port cells have different ports for read and write operations. Two 9 transistor and two 10 transistor SRAM cells have been evaluated using the N-Curve Method. This method provides better analysis than the traditionally used Butterfly Curve method in submicron regions. The performance evaluation in this paper also includes Leakage Current, Cell Standby Current, Read Current and Data Retention Voltage (DRV). The SRAM cell simulations are performed on 22 nm, 32 nm and 45 nm CMOS technology nodes. All SRAM cells showed moderately desirable parameters, with each cell displaying a performance edge in a certain niche. However, the 9T SRAM cell with supply feedback provided considerably good performance parameters across all technology nodes, exhibiting the highest noise margins, lowest leakage currents, lowest data retention voltage and the lowest read currents.
用n曲线法分析不同双端口SRAM电池在深亚微米区域的稳定性
本文在深亚微米区域分析了不同的双端口SRAM单元结构。双端口单元具有用于读和写操作的不同端口。使用n曲线法对两个9晶体管和两个10晶体管SRAM单元进行了评估。该方法比传统的蝴蝶曲线法在亚微米区域的分析效果更好。本文的性能评估还包括泄漏电流、电池待机电流、读取电流和数据保持电压(DRV)。SRAM单元模拟分别在22nm、32nm和45nm的CMOS技术节点上进行。所有SRAM单元都显示出适度理想的参数,每个单元在特定的利基中显示出性能优势。然而,具有电源反馈的9T SRAM单元在所有技术节点上都提供了相当好的性能参数,表现出最高的噪声裕度、最低的泄漏电流、最低的数据保留电压和最低的读取电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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