A detailed review on Double Gate and Triple Gate Tunnel Field Effect Transistors

A. S. Geege, N. Armugam, P. Vimala, T. Samuel
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引用次数: 1

Abstract

In the last three decades, Scaling of complementary metal-oxide semiconductor (CMOS) technology been gateway to continual development in the silicone basis semiconductor industry. Nevertheless, as technology scaling reaches the nanometer system, CMOS devices face many serious issues such as enhanced leakage currents, on-current difficulties, large variations in parameters, poor reliability and yield, higher manufacturing costs, and so on. The Tunnel field-effect transistor (TFET) suggested as a most propitious option compared to CMOS devices. TFET is suitable because of its steep slope possibilities and the corresponding benefits in functioning at limited supply voltage. In this paper, we explored different interface structures related to the Double Gate TFET(DG-TFET) and Triple Gate TFET(TG-TFET).
详细介绍了双栅和三栅隧道场效应晶体管
在过去的三十年中,互补金属氧化物半导体(CMOS)技术的扩展是硅基半导体工业持续发展的门户。然而,随着技术规模达到纳米级,CMOS器件面临着泄漏电流增强、通流困难、参数变化大、可靠性和良率差、制造成本高等严重问题。与CMOS器件相比,隧道场效应晶体管(TFET)被认为是最有利的选择。由于其陡坡可能性和在有限电源电压下工作的相应好处,TFET是合适的。在本文中,我们探讨了与双门TFET(DG-TFET)和三门TFET(TG-TFET)相关的不同界面结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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