Newly developed integration method for biomedical implants using flexible polymer cable

2010 12th Electronics Packaging Technology Conference Pub Date : 2010-12-01 DOI:10.1109/EPTC.2010.5702669

Daquan Yu, Ming-Yuan Cheng, L. Lim, Myo Paing, Yu Aibin

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引用次数: 5

Abstract

This paper presented an integration method for biomedical implants by using solder bonding and highly flexible polyimide (PI) cable. The proposed integration method can overcame the problems in flexible cable assembly before. It can achieve a small form, and better reliability, and is easier for fragile MEMS device bonding by using solder bonding. Therefore, it is suitable for various MEMS devices integration. The effect of the metal materials and reliability of the flexible cable with thin metal trace were studied. SEM and TEM/EDX analysis were performed to evaluate the boning interface microstructures. Electrical tests were carried out to study the resistance of the interconnects. Thermal cycling test with temperature range of −40/+125ଌ with 15mins dwell for 500 cycles was used to evaluate the reliability properties of the interconnects. The results showed good bonding interface, low electrical resistance and there were no major changes in resistance during thermal cycling. Hence, it implied that the interconnections were highly stable and reliable by using the proposed bonding method.

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基于柔性聚合物电缆的生物医学植入物集成新方法

提出了一种利用高柔性聚酰亚胺(PI)电缆与焊料键合的生物医学植入体集成方法。所提出的集成方法克服了以往柔性电缆装配中存在的问题。它可以实现体积小，可靠性好，并且更容易对脆弱的MEMS器件进行焊接。因此，它适用于各种MEMS器件的集成。研究了金属材料对细金属线柔性电缆可靠性的影响。采用扫描电镜(SEM)和透射电镜(TEM/EDX)等分析方法对其微观结构进行了表征。进行了电学试验，以研究互连线的电阻。热循环试验温度范围为- 40/+125ଌ，停留时间为15分钟，循环500次，用于评估互连的可靠性特性。结果表明，复合材料粘结界面良好，电阻低，热循环过程中电阻无明显变化。由此可见，采用所提出的连接方法，其互连具有较高的稳定性和可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2010 12th Electronics Packaging Technology Conference

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