Multi-chip Module Based GaAs MMICs Packaging for L-Band High Gain Application

Abstract

this paper details a multi-chip module (MCM) suitable for GaAs monolithic microwave integrated circuit common control high gain block MCM package design, 3D EM simulation of the package, package fabrication and end module level execution, which includes assembly and testing under various environmental test conditions as per the space standards. This MCM package designed using three internally separated cavities for individual cavity isolation, 4-RF Ports, 10mil thin film microstrip line and optimized wire bonding interconnects, and the same package is EM simulated using a CST microwave studio. This package modelled and fabricated using kovar material. This MCM package proposed to house a chain of four amplifiers with a common gain of 69dB, 2 SPDT switches with insertion loss of 3.6dB, a digital attenuator with initial attenuation of 2.5dB with TTL driver and 2 thermopads of 3dB individual attenuation. This package resonating frequency is 7.484GHz. The packaged MCM measurements are carried out over a frequency of 1.1GHz-1.4GHz and resulted with S21 of 60dB, S11&S22 of better than 15dB and P1dB out of 15dBm.