Fabrication and Characterization of p-type SnO Thin-Film Transistors by Reactive DC Magnetron Sputtering

Chien-Yie Tsay, M. Lin, Fong-Yi Chang, Yu-Wu Wang
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引用次数: 1

Abstract

In this study, the p-type SnO thin films were prepared on Si/SiO2 substrates by reactive DC magnetron sputtering and post-annealing treatment. We investigated the effects of annealing temperature on the electrical properties of the p-type SnO semiconductor thin films and thin-film transistors. XRD examination confirmed that these as-prepared SnO thin films were polycrystalline in nature and exhibited tetragonal SnO structure. The electrical resistivity of the annealed SnO thin films increased with raising annealing temperature because the reduction in the hole concentration. According to the transfer characteristics of the SnO TFTs, it was found that raising annealing temperature not only reduced the on current and off current but also leaded to the threshold voltage shifted towards negative voltage region. The TFT with a 200 °C annealed SnO active channel layer showed the highest on-to-off current ratio of 3.35×103, the smallest subthreshold swing of 10.0 V/dec, and a mobility of 1.65 cm2/Vs.
反应性直流磁控溅射制备p型SnO薄膜晶体管及表征
本研究通过反应直流磁控溅射和后退火处理,在Si/SiO2衬底上制备了p型SnO薄膜。研究了退火温度对p型SnO半导体薄膜和薄膜晶体管电学性能的影响。XRD检测结果表明,制备的SnO薄膜为多晶结构,具有四方SnO结构。退火后SnO薄膜的电阻率随着退火温度的升高而升高,这是由于空穴浓度的降低。根据SnO TFTs的转移特性,发现提高退火温度不仅使导通电流和关断电流减小,而且使阈值电压向负电压区偏移。在200°C退火的SnO有源沟道层中,TFT的通断电流比最高,为3.35×103,亚阈值摆幅最小,为10.0 V/dec,迁移率为1.65 cm2/Vs。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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