Dynamic Thermal Management for system-on-chip using bus arbitration

Sudheendra K. Srivathsa, Vikram B. Suresh, Pavan Panchapakeshan, S. Kundu
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Abstract

Increasing on-chip temperature in SoC designs has reinforced the need for Dynamic Thermal Management (DTM). The conventional DTM techniques adopted in microprocessors based on DVFS are not suitable in the context of SoCs as they tend to have multiple voltage and frequency domains. In this paper we propose a reactive and a predictive DTM technique using bus arbitration. Based on the thermal profile the bus grants and hence the bus transactions are controlled. This regulates the data flow which reduces the activity in the functional units. The results show that the on-chip temperature can be maintained 3–5°C below the chip temperature threshold with a worst case performance penalty of 5% and a fast response time of at most 5 clock cycles. The hardware cost of implementing the proposed scheme is 3619.7μm2 in 45nm technology, which is less than 0.06% of the chip area. Apart from its simplicity, lower cost and effectiveness, the solution is non-intrusive on the design and scalable to many cores.
基于总线仲裁的片上系统动态热管理
SoC设计中片上温度的提高加强了对动态热管理(DTM)的需求。基于DVFS的微处理器中采用的传统DTM技术不适合soc,因为它们往往具有多个电压和频域。本文提出了一种基于总线仲裁的响应式和预测式DTM技术。基于热概况总线授予,因此总线事务被控制。这调节了数据流,从而减少了功能单元中的活动。结果表明,片上温度可以保持在芯片温度阈值以下3-5°C,最坏情况下性能损失为5%,响应时间最多为5个时钟周期。在45nm工艺下,实现该方案的硬件成本为3619.7μm2,不到芯片面积的0.06%。除了简单、低成本和高效之外,该解决方案在设计上是非侵入性的,并且可扩展到许多核心。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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