A Transfer Model of High-G Shock for MEMS in Real Working Conditions

Abstract

High-g shock is a critical challenge for MEMS. The acceleration that eventually acts on the microstructure of MEMS is usually different from the original shock in terms of amplitude and frequency due to factors like mounting and packaging. This inconsistency makes it difficult to measure the shocks accurately and assess the reliability of MEMS. This paper proposes a system-level transfer model of shock for MEMS in actual working conditions based on the lumped mechanical system model. Numerical and experimental results validated the effectiveness of this model. Mounting and packaging methods, which may influence the transfer process of high-g shock, were then analyzed. Several shock-resistant suggestions based on our model were proposed and experimentally validated.