A 97–107 GHz Triple-Stacked-FET Power Amplifier with 23.7dB Peak Gain, 15.1dBm PSAT, and 18.6% PAEMAX in 28-nm FD-SOI CMOS

Kyunghwan Kim, Kangseop Lee, Seung-Uk Choi, Ji-Seong Kim, Chan-Gyu Choi, Ho-Jin Song
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引用次数: 2

Abstract

A 97–107 GHz power amplifier (PA) based on a stacked-FET topology is presented. In a triple-stacked-FeT structure, stacking efficiency is analyzed using four combinations of series or shunt inductors for compensating phase of impedances between stack nodes, and optimal inductances are chosen. Phase-compensation inductors are implemented by considering a finite quality factor with the tradeoff between layout size and stacking efficiency. A layout of a transistor cell is customized to reduce gate resistance. The triple-stacked-FET PA provides peak PSAT and PAEMAX of 15.1 dBm and 18.6%, respectively. The presented PA achieves the highest power density and efficiency compared to state-of-the-art CMOS PAs in F-band.
一种97-107 GHz三叠场效应晶体管功率放大器,峰值增益23.7dB, PSAT 15.1dBm, PAEMAX 18.6%,采用28nm FD-SOI CMOS
提出了一种基于堆叠fet拓扑结构的97-107 GHz功率放大器。在三层堆叠fet结构中,采用串联或并联电感的四种组合来补偿堆叠节点之间的相位阻抗,分析了堆叠效率,并选择了最优电感。相位补偿电感通过考虑一个有限的质量因子,在布局尺寸和堆叠效率之间进行权衡来实现。晶体管单元的布局是定制的,以减少栅极电阻。三层fet放大器的峰值PSAT和PAEMAX分别为15.1 dBm和18.6%。与f波段最先进的CMOS放大器相比,该放大器实现了最高的功率密度和效率。
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