Daniel Kostynski, S. Sack, Peter Kolter, M. Glavanovics
{"title":"A Multi-Channel System for Active Thermal Cycling of Discrete Power Semiconductors Based on Mission Profiles","authors":"Daniel Kostynski, S. Sack, Peter Kolter, M. Glavanovics","doi":"10.1109/ASDAM55965.2022.9966759","DOIUrl":null,"url":null,"abstract":"Within this paper a test system is introduced which is able to cycle multiple discrete power semiconductors in a hybrid manner within a wide temperature range, based on arbitrary programmable temperature mission profiles. Based on these profiles active power cycling is performed in combination with different static climatic conditions. The aim of this kind of test is to emulate the real thermal stress the device would undergo in harsh environments, where strong temperature changes could lead to a faster degradation of the device. With this approach the reliability of the device can be evaluated without the need for a lifetime model, as it is based on standard temperature cycling methods.","PeriodicalId":148302,"journal":{"name":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","volume":"111 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASDAM55965.2022.9966759","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Within this paper a test system is introduced which is able to cycle multiple discrete power semiconductors in a hybrid manner within a wide temperature range, based on arbitrary programmable temperature mission profiles. Based on these profiles active power cycling is performed in combination with different static climatic conditions. The aim of this kind of test is to emulate the real thermal stress the device would undergo in harsh environments, where strong temperature changes could lead to a faster degradation of the device. With this approach the reliability of the device can be evaluated without the need for a lifetime model, as it is based on standard temperature cycling methods.