{"title":"Development of a burn-in time reduction algorithm using the principles of acceleration factors","authors":"Alan Suyko, S. Sy","doi":"10.1109/RELPHY.1991.146026","DOIUrl":null,"url":null,"abstract":"To have fast EPROM manufacturing turnaround time and be cost-effective in a highly competitive market, a reduction in burn-in time is highly desirable. The author addresses this manufacturing issue. By using the principles of temperature and electric field acceleration factors and taking into consideration the prevailing device and burn-in equipment limitations, a new and simple algorithm for reducing the burn-in time has been developed. Experiments were performed on different nonvolatile memory products of various fabrication process technologies to prove the efficacy and manufacturability of this application.<<ETX>>","PeriodicalId":319362,"journal":{"name":"29th Annual Proceedings Reliability Physics 1991","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1991-04-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"29th Annual Proceedings Reliability Physics 1991","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1991.146026","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11
Abstract
To have fast EPROM manufacturing turnaround time and be cost-effective in a highly competitive market, a reduction in burn-in time is highly desirable. The author addresses this manufacturing issue. By using the principles of temperature and electric field acceleration factors and taking into consideration the prevailing device and burn-in equipment limitations, a new and simple algorithm for reducing the burn-in time has been developed. Experiments were performed on different nonvolatile memory products of various fabrication process technologies to prove the efficacy and manufacturability of this application.<>