Interband-tunneling III-V semiconductor structures for multiple-valued literal and arithmetic functions

L. Micheel, H. Hartnagel, W. Anderson, S. Kirchoefer, N. Papanicolaou
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引用次数: 2

Abstract

Earlier MVL circuits used resonant tunneling devices based on intraband tunneling. Recently device concepts were explored in the AlSb/InAs system based on interband tunneling. Here non-resonant tunneling discharge from the 2DEG is effected into p/sup +/ doped InAs gates, whereas the 2DEG current is controlled with a Schottky gate as in the conventional HEMT. A wide range of physical and functional device features is possible. Linear properties of the proposed tunneling HEMTs are used for signal summation. The authors explore basic ternary half adders and redundant MVL full adders. The interband tunneling also leads to highly effective literal circuits with applications in MVL synthesis and pattern recognition. Vertically integrated tunnel gates are introduced. Recommendations for experiments and further theoretical work conclude this paper.<>
用于多值文字和算术函数的带间隧道III-V半导体结构
早期的MVL电路使用基于带内隧穿的谐振隧穿装置。近年来,人们对基于带间隧道的AlSb/InAs系统的器件概念进行了探索。在这里,来自2DEG的非谐振隧道放电被影响到p/sup +/掺杂的InAs栅极,而2DEG电流则像传统HEMT一样由肖特基栅极控制。广泛的物理和功能设备特性是可能的。利用所提出的隧穿hemt的线性特性进行信号求和。探讨了基本的三元半加法器和冗余的MVL全加法器。带间隧穿还导致了高效的文字电路,应用于MVL合成和模式识别。介绍了垂直一体化隧道闸门。最后对实验和进一步的理论工作提出了建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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