A. D. Raki, T. Taimre, K. Bertling, Y. Lim, P. Dean, J. Keeley, A. Valavanis, R. Alhathlool, S. Khanna, M. Lachab, D. Indjin, Z. Ikonić, P. Harrison, E. Linfield, A. Davies
{"title":"Self-mixing effect in THz quantum cascade lasers: Applications in sensing and imaging","authors":"A. D. Raki, T. Taimre, K. Bertling, Y. Lim, P. Dean, J. Keeley, A. Valavanis, R. Alhathlool, S. Khanna, M. Lachab, D. Indjin, Z. Ikonić, P. Harrison, E. Linfield, A. Davies","doi":"10.1109/ICP.2013.6687056","DOIUrl":null,"url":null,"abstract":"The paper introduces self-mixing interferometry in semiconductor lasers in general, and then discusses recent advancements in the coherent THz imaging and sensing systems based on the self-mixing effect in terahertz quantum cascade lasers. Two different imaging modalities are used to illustrate the coherent nature of this sensing technique and its applications to three-dimensional surface profiling and material identification.","PeriodicalId":308672,"journal":{"name":"2013 IEEE 4th International Conference on Photonics (ICP)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE 4th International Conference on Photonics (ICP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICP.2013.6687056","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The paper introduces self-mixing interferometry in semiconductor lasers in general, and then discusses recent advancements in the coherent THz imaging and sensing systems based on the self-mixing effect in terahertz quantum cascade lasers. Two different imaging modalities are used to illustrate the coherent nature of this sensing technique and its applications to three-dimensional surface profiling and material identification.