The evolution of silicon-on-insulator MOSFETs

J. Colinge
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引用次数: 9

Abstract

This paper deals with evolution of silicon-on-insulator MOSFET. In 1964 partially depleted devices fabricated on silicon-on-sapphire substrates was developed and was successfully used in numerous military and civilian applications and still used to realize commercial HF circuits in fully depleted CMOS. The first fully depleted SOI MOSFET was established in early 1980 with superior transconductance, current drive and subthreshold swing. Double-gate SOI MOSFET was established in 1984 with resemblance of the XMOS structure and good short-channel characteristics. Later vertical-channel MOSFET, triangular-wire SOI MOSFET and /spl Delta/-channel MOSFET was established. Practical implementation of planar double-gate MOSFET was observed in 1990. The evolution of SOI MOSFET seems ineluctable as high drive with short-channel immunity becomes a problem and can no longer be solved by classical approach.
绝缘体上硅mosfet的发展
本文讨论了绝缘体上硅MOSFET的发展。1964年,在蓝宝石上硅衬底上制造的部分耗尽器件被开发出来,并成功地用于许多军事和民用应用,并且仍然用于在完全耗尽的CMOS中实现商业高频电路。第一个完全耗尽的SOI MOSFET于1980年初建立,具有优异的跨导性,电流驱动和亚阈值摆幅。双栅SOI MOSFET于1984年问世,具有类似XMOS结构和良好的短沟道特性。后来建立了垂直沟道MOSFET,三角线SOI MOSFET和/spl Delta/沟道MOSFET。1990年观察到平面双栅MOSFET的实际实现。SOI MOSFET的发展似乎不可避免,因为具有短通道抗扰度的高驱动已成为经典方法无法解决的问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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