Consolidation of AZ31 magnesium chips using equal channel angular pressing

Majid Al-Maharbi, Almundher Al-Namani
{"title":"Consolidation of AZ31 magnesium chips using equal channel angular pressing","authors":"Majid Al-Maharbi, Almundher Al-Namani","doi":"10.21741/9781644902615-24","DOIUrl":null,"url":null,"abstract":"Abstract. Equal channel angular pressing (ECAP) as a severe plastic deformation (SPD) technique was employed for consolidation of AZ31 magnesium chips. The chips were consolidated at a temperature of 300 °C following ECAP route A up to two passes. The optical and scanning electron micrographs reveal that consolidation have taken place and the quality of consolidation improves with number of ECAP passes and hence the total imposed strain. The Vickers hardness of the processed samples increased from 41 of the as cast used to generate the chips to 47.7 ad 58.5 of consolidated samples after one and two passes respectively. The consolidation of chips was accompanied by the breakage and dispersion of the oxide layer developed on the surface of the chips during and after machining.","PeriodicalId":242571,"journal":{"name":"Superplasticity in Advanced Materials","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Superplasticity in Advanced Materials","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.21741/9781644902615-24","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Abstract. Equal channel angular pressing (ECAP) as a severe plastic deformation (SPD) technique was employed for consolidation of AZ31 magnesium chips. The chips were consolidated at a temperature of 300 °C following ECAP route A up to two passes. The optical and scanning electron micrographs reveal that consolidation have taken place and the quality of consolidation improves with number of ECAP passes and hence the total imposed strain. The Vickers hardness of the processed samples increased from 41 of the as cast used to generate the chips to 47.7 ad 58.5 of consolidated samples after one and two passes respectively. The consolidation of chips was accompanied by the breakage and dispersion of the oxide layer developed on the surface of the chips during and after machining.
等通道角压AZ31镁片的固结
摘要采用等通道角压(ECAP)作为强塑性变形(SPD)技术对AZ31镁片进行固结。芯片在300°C的温度下固结,遵循ECAP路线a最多两道。光学和扫描电子显微图显示,固结已经发生,固结质量随着ECAP通过次数的增加而提高,因此总施加应变也随之增加。经过一道和两道处理后,加工样品的维氏硬度分别从铸坯时的41提高到47.7和58.5。切屑的固结过程伴随着切屑表面氧化层的断裂和分散。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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