Auxetic Superelastic TiNiCuCo Sputtered Thin-Films For Stretchable Electronics

Sabrina M. Curtis, Duygu Dengiz, L. Bumke, E. Quandt
{"title":"Auxetic Superelastic TiNiCuCo Sputtered Thin-Films For Stretchable Electronics","authors":"Sabrina M. Curtis, Duygu Dengiz, L. Bumke, E. Quandt","doi":"10.31399/asm.cp.smst2022p0011","DOIUrl":null,"url":null,"abstract":"\n Auxetic shape memory alloy (SMA) materials are candidates for ballistics, deployable antennas, actuators, stretchable electronics, and biomedical devices. Auxetic materials are periodic structures characterized by a negative Poisson's ratio, meaning they expand laterally when stretched longitudinally. The work presented here shows the mechanical properties of auxetic structures are significantly improved by using sputtered superelastic shape memory alloy materials compared to traditional materials (e.g., Cu, Si). In particular, sputtered freestanding TiNiCuCo SMAs offer advantages as substrates for stretchable electronics. Two novel auxetic structures with enhanced expandability and compressibility are presented, fabricated from sputtered TiNiCuCo. The novel geometries presented in this work are based on the combination of the auxetic rotating rectangle structure where the rotating hinges are replaced by two common stretchable interconnects (e.g., serpentines and Archimedean spirals). The influence of functional fatigue on the electrical properties, thermal-induced and stress-induced phase transformations of the novel stretchable auxetic TiNiCuCo thin-films are presented.","PeriodicalId":119283,"journal":{"name":"SMST 2022: Extended Abstracts from the International Conference on Shape Memory and Superelastic Technologies","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"SMST 2022: Extended Abstracts from the International Conference on Shape Memory and Superelastic Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.cp.smst2022p0011","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Auxetic shape memory alloy (SMA) materials are candidates for ballistics, deployable antennas, actuators, stretchable electronics, and biomedical devices. Auxetic materials are periodic structures characterized by a negative Poisson's ratio, meaning they expand laterally when stretched longitudinally. The work presented here shows the mechanical properties of auxetic structures are significantly improved by using sputtered superelastic shape memory alloy materials compared to traditional materials (e.g., Cu, Si). In particular, sputtered freestanding TiNiCuCo SMAs offer advantages as substrates for stretchable electronics. Two novel auxetic structures with enhanced expandability and compressibility are presented, fabricated from sputtered TiNiCuCo. The novel geometries presented in this work are based on the combination of the auxetic rotating rectangle structure where the rotating hinges are replaced by two common stretchable interconnects (e.g., serpentines and Archimedean spirals). The influence of functional fatigue on the electrical properties, thermal-induced and stress-induced phase transformations of the novel stretchable auxetic TiNiCuCo thin-films are presented.
用于可拉伸电子器件的补强超弹性TiNiCuCo溅射薄膜
形状记忆合金(SMA)材料是弹道学、可展开天线、致动器、可拉伸电子设备和生物医学设备的候选材料。增减材料是一种周期性结构,其特征是负泊松比,这意味着它们在纵向拉伸时横向膨胀。本文的研究表明,与传统材料(如Cu、Si)相比,使用溅射超弹性形状记忆合金材料可以显著改善形变结构的力学性能。特别是,溅射独立式TiNiCuCo sma作为可拉伸电子器件的衬底具有优势。提出了两种增强可压缩性和可膨胀性的新型消声结构。在这项工作中提出的新几何形状是基于auxetic旋转矩形结构的组合,其中旋转铰链被两个常见的可拉伸互连(例如,蛇形和阿基米德螺旋)所取代。研究了功能疲劳对TiNiCuCo薄膜电学性能、热致相变和应力致相变的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信