High temperature operation of n-type 6H-SiC and p-type diamond MESFETs

M. Shin, G. Bilbro, R. Trew
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引用次数: 5

Abstract

Large signal RF and DC performance of n-type 6H-SiC and p-type diamond MESFETs has been simulated at various operating temperatures by a large-signal RF simulator using the harmonic balance technique and the two-dimensional device simulator, PISCES-IIB. The RF performance of SiC MESFET is predicted to be optimal in a temperature range slightly higher than room temperature. At room temperature the simulated SiC MESFET exhibits an output power of 3.5 W/mm for an operating frequency of 8 GHz with 16.5 dB gain and 44% power-added efficiency at 24 dBm input power. In contrast to the SiC MESFET, the RF performance of the diamond MESFET is improved with temperature, but the current level is much lower than that in SiC in the entire temperature region investigated. The very different temperature dependencies of DC and RF performance in SiC and diamond MESFETs are attributed to the significant difference in the dopant ionization energies in SiC and diamond.<>
n型6H-SiC和p型金刚石mesfet的高温工作
采用谐波平衡技术和二维器件模拟器PISCES-IIB,对n型6H-SiC和p型金刚石mesfet在不同工作温度下的大信号射频和直流性能进行了模拟。预测SiC MESFET的射频性能在略高于室温的温度范围内是最佳的。在室温下,模拟的SiC MESFET在24 dBm输入功率下,工作频率为8 GHz,输出功率为3.5 W/mm,增益为16.5 dB,功率增加效率为44%。与SiC MESFET相比,金刚石MESFET的射频性能随温度的升高而提高,但在整个温度范围内的电流水平远低于SiC MESFET。SiC和金刚石mesfet中直流和射频性能的温度依赖性是由于SiC和金刚石中掺杂剂电离能的显著差异造成的。
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