{"title":"The ALICE Pixel Sensor Upgrade","authors":"L. Lautner","doi":"10.22323/1.420.0026","DOIUrl":null,"url":null,"abstract":"The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mm and fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 µ m and held in place by carbon foam spacers, resulting in an unprecedented material budget of O(0.05%) 𝑋 / 𝑋 0 per layer. This contribution will present the detector concept, summarise the results of the R&D program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.","PeriodicalId":275608,"journal":{"name":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 10th International Workshop on Semiconductor Pixel Detectors for Particles and Imaging — PoS(Pixel2022)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.22323/1.420.0026","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The inner tracking system (ITS2) of the ALICE experiment is foreseen to be upgraded during the Long Shutdown 3 of the Large Hadron Collider (LHC). First data are expected to be taken during Run 4 with the upgraded High-Luminosity LHC. The planned ITS3 detector will be based on stitched, wafer-scale Monolithic Active Pixel Sensors (MAPS), bent to radii of 18, 24, and 30 mm and fabricated on 300 mm wafers in a 65 nm CMOS Imaging technology. They will be thinned down to below 50 µ m and held in place by carbon foam spacers, resulting in an unprecedented material budget of O(0.05%) 𝑋 / 𝑋 0 per layer. This contribution will present the detector concept, summarise the results of the R&D program, including most recent 65 nm prototypes, and provide an outlook on the path towards the final sensor development.