The fabrication of silicon microsystems

D. Wood
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引用次数: 5

Abstract

The subject of silicon microsystems is reviewed from a device manufacturing viewpoint. Techniques taken straight from the integrated-circuit industry were the starting point for this work. Because of the 3D nature of microsystems, different processes have been developed to fully exploit the potential of this field, particularly in substrate etching and lithography. The paper explores the developments that have been made in this area, and how it is likely that microelectronics and microsystems, from a manufacturing point of view, will diverge even further in the future.
硅微系统的制造
从器件制造的角度对硅微系统进行了综述。直接来自集成电路工业的技术是这项工作的起点。由于微系统的3D特性,已经开发了不同的工艺来充分利用这一领域的潜力,特别是在衬底蚀刻和光刻方面。本文探讨了在这一领域取得的进展,以及从制造的角度来看,微电子和微系统在未来可能会进一步分化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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