Test effectiveness evaluation through analysis of readily-available tester data

Yen-Tzu Lin, R. D. Blanton
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引用次数: 8

Abstract

Test metrics and fault models continue to evolve to keep up with defect characteristics associated with ever-changing fabrication processes. Understanding the relative effectiveness of current and proposed metrics and models is therefore important for selecting the best mix of methods for achieving a desired level of quality at reasonable cost. Test-metric and fault model evaluation traditionally relies on large, time-consuming silicon-based test experiments. Specifically, tests generated for some specific metric/model are applied to real chips, and unique chip-fail detections are used as relative measures of effectiveness. To reduce the cost of evaluating new test metrics, fault models, DFT techniques, etc., this work proposes a new approach that exploits the readily-available test-measurement data in chip-failure log files. The new approach does not require the generation and application of new patterns but uses analysis results from existing tests. We demonstrate the method by comparing several metrics and models that include: (i) stuck-at, (ii) N-detect, (iii) PAN-detect (physically-aware N-detect), (iv) bridge fault models, and (v) the input pattern fault model (also more recently referred to as the gate-exhaustive metric).
通过分析现成的测试数据来评估测试的有效性
测试度量和故障模型不断发展,以跟上与不断变化的制造过程相关的缺陷特征。因此,了解当前和建议的度量标准和模型的相对有效性对于选择最佳的方法组合以合理的成本达到期望的质量水平是很重要的。测试度量和故障模型评估传统上依赖于大型、耗时的基于硅的测试实验。具体来说,为某些特定度量/模型生成的测试应用于实际芯片,并使用独特的芯片故障检测作为有效性的相对度量。为了降低评估新测试指标、故障模型、DFT技术等的成本,本工作提出了一种利用芯片故障日志文件中现成的测试测量数据的新方法。新方法不需要生成和应用新的模式,而是使用来自现有测试的分析结果。我们通过比较几个指标和模型来演示该方法,这些指标和模型包括:(i)卡滞,(ii) n检测,(iii) pan检测(物理感知n检测),(iv)桥故障模型,以及(v)输入模式故障模型(最近也被称为门穷举度量)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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