Thermal analysis and modelling of planar magnetic components

M. Rascon, J. Ara, R. Madsen, J. Navas, M. Perez, F. San Miguel
{"title":"Thermal analysis and modelling of planar magnetic components","authors":"M. Rascon, J. Ara, R. Madsen, J. Navas, M. Perez, F. San Miguel","doi":"10.1109/APEC.2001.911633","DOIUrl":null,"url":null,"abstract":"Planar magnetic components are widely used in new designs of power supplies due to advantages that they offer. Several works have been done concerning the optimization of the electrical and magnetic design. However, the thermal design of these components has not been studied deeply, and less information is available to predict the temperatures in core and windings of the component during the design stage. This paper addresses such issues for stand alone planar magnetic components and those with windings integrated in the printed circuit board (PCB). Thermal dissipation methods, models and several experiments are described. They allow a better thermal calculation of the planar magnetics components in the early design stage.","PeriodicalId":201844,"journal":{"name":"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-03-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"APEC 2001. Sixteenth Annual IEEE Applied Power Electronics Conference and Exposition (Cat. No.01CH37181)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/APEC.2001.911633","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19

Abstract

Planar magnetic components are widely used in new designs of power supplies due to advantages that they offer. Several works have been done concerning the optimization of the electrical and magnetic design. However, the thermal design of these components has not been studied deeply, and less information is available to predict the temperatures in core and windings of the component during the design stage. This paper addresses such issues for stand alone planar magnetic components and those with windings integrated in the printed circuit board (PCB). Thermal dissipation methods, models and several experiments are described. They allow a better thermal calculation of the planar magnetics components in the early design stage.
平面磁性元件的热分析与建模
平面磁性元件由于其自身的优势,在新型电源设计中得到了广泛的应用。本文还对电机的电磁设计进行了优化。然而,这些元件的热设计尚未得到深入的研究,在设计阶段对元件的铁芯和绕组的温度进行预测的信息较少。本文讨论了独立平面磁性元件和在印刷电路板(PCB)中集成绕组的磁性元件的这类问题。介绍了热耗散方法、模型和若干实验。它们允许在早期设计阶段对平面磁性元件进行更好的热计算。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信