Realising the potential of SiC devices

C. Harris, P. Ericsson, S. Savage, A. Konstantinov, M. Bakowski
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Abstract

Only in the last 12 months have we seen the first truly commercial SiC devices being launched on the marketplace. One key factor has been the development in wafer production. This paper looks at developments in three important areas, high frequency transistors, high power devices and high temperature sensors. In each case recent developments in design and technology have allowed the realisation of devices that make use of the material properties to achieve performance far beyond that possible with conventional semiconductors.
实现SiC器件的潜力
只有在过去的12个月里,我们才看到第一个真正的商用SiC设备在市场上推出。其中一个关键因素是晶圆生产的发展。本文着眼于高频晶体管、大功率器件和高温传感器三个重要领域的发展。在每一种情况下,设计和技术的最新发展都使利用材料特性的设备实现了远远超过传统半导体的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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