Planar GaAs p-n junctions by Be ion implantation

M. Helix, K. Vaidyanathan, B. Streetman, P. Chatterjee
{"title":"Planar GaAs p-n junctions by Be ion implantation","authors":"M. Helix, K. Vaidyanathan, B. Streetman, P. Chatterjee","doi":"10.1109/IEDM.1977.189203","DOIUrl":null,"url":null,"abstract":"The fabrication of planar p-n junctions in GaAs by Be ion implantation is described and the properties of these junctions are compared with Zn-implanted and Zn-diffused diodes. The Be-implanted diodes exhibit good forward characteristics, very low reverse leakage current, and high breakdown voltage. It appears that lateral diffusion is negligible in this fabrication method, suggesting that such junctions may be used in GaAs integrated circuit applications.","PeriodicalId":218912,"journal":{"name":"1977 International Electron Devices Meeting","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1977 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1977.189203","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

The fabrication of planar p-n junctions in GaAs by Be ion implantation is described and the properties of these junctions are compared with Zn-implanted and Zn-diffused diodes. The Be-implanted diodes exhibit good forward characteristics, very low reverse leakage current, and high breakdown voltage. It appears that lateral diffusion is negligible in this fabrication method, suggesting that such junctions may be used in GaAs integrated circuit applications.
Be离子注入的平面GaAs p-n结
介绍了用Be离子注入在砷化镓中制备平面p-n结的方法,并将其性能与注入锌二极管和扩散锌二极管进行了比较。be -植入式二极管具有良好的正向特性,极低的反向漏电流和高击穿电压。在这种制造方法中,横向扩散似乎可以忽略不计,这表明这种结可以用于砷化镓集成电路应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信