Progress toward polymeric materials for electronic applications

Abstract

Electronic equipment is becoming increasingly simple to operate, more compact and lighter in weight, with higher performance and multi-functional capabilities. Semiconductor devices used in this equipment are required to have an ultra-large scale of integration, with ultra-high circuit density on a submicron level and large 64 Mbit and 256 Mbit capacities. Based on composite technologies fostered through development of device structures, process technologies, and manufacturing equipment and materials, we are continuously creating excellent new products that are among the most advanced in the world, using such technologies as the recombination, composition and fusion of materials or raw materials. In this paper, we show trends in semiconductor devices and packaging technologies. We then introduce the relationship between these technologies and our commercial products in brief.